The Union Minister for Electronics and Information Technology, Ashwini Vaishnaw, announced that students from the Indian Institutes of Technology (IITs) have designed a total of 20 microchipsets. Impressively, 8 of these chip designs have already been “taped out” ;a key stage in semiconductor production and sent for fabrication. This marks an important step toward strengthening India's self-reliance in semiconductor technology and chip manufacturing.
In the semiconductor industry, “tape-out” refers to the final design layout of a chip that is sent to a fabrication foundry to manufacture the physical silicon wafer. Achieving tape-out is one of the most critical milestones in chip development, indicating that the digital design is ready for production.
With 8 tape-outs completed by IIT students, India is demonstrating capability in complex chip design, previously dominated by global semiconductor hubs.
The 20 chipsets designed cover various applications including artificial intelligence (AI) accelerators, communication chips, embedded processors, and power-efficient microcontrollers. These designs are part of a larger initiative to promote indigenous semiconductor research and skill development in India’s premier technical institutes.
According to Minister Vaishnaw, the initiative stems from collaborations between the Ministry of Electronics and Information Technology (MeitY), IIT campuses, and industry experts to groom talent capable of addressing India’s semiconductor ecosystem needs.
The announcement aligns closely with the National Semiconductor Mission and the Make in India program, which emphasize developing cutting-edge semiconductor design and fabrication capabilities domestically.
While tape-out signifies readiness for fabrication, the actual manufacturing of these chips depends on collaborations with fabrication facilities, both domestic and international. India currently lacks large-scale semiconductor foundries but aims to build capacity through proposed manufacturing clusters and partnerships with global foundries.
The chipsets designed by IITs are being sent to foundries in countries such as Taiwan and the U.S. for initial fabrication and testing, with an eye on eventually moving production to Indian fabs once they become operational.
Despite the progress, India faces challenges such as lack of in-country fabrication infrastructure, high capital expenses for fabs, and the need for ecosystem maturity. Still, the Ministry remains optimistic:
“The talent pool has been built, and with sustained investment, India will join the league of key chip designing and manufacturing countries,” said Vaishnaw.
IIT students’ success in designing 20 chipsets with 8 already taped out for fabrication is a landmark achievement showing the powerful role of academia in India’s semiconductor ambitions. This feat promises to accelerate the country’s transition toward self-sufficiency in technology critical for national security, economic growth, and digital innovation.